Technical Parameter Matrix
1. High Hydrogen Series: Poly(methylhydrosiloxane)
| Parameter | Index |
|---|---|
| Appearance | Colorless and transparent oil |
| Viscosity (25℃) | 25 ± 5 mm²/s |
| Hydrogen Content (wt%) | 1.58 (typical value) |
| Refractive Index | 1.39 – 1.40 |
| Open Cup Flash Point | ≥150℃ |
2. Low Hydrogen Series: Graded Reactive Oils
| Hydrogen Content (wt%) | Viscosity (mm²/s) | Volatile Matter |
|---|---|---|
| 0.18 | 60 – 130 | ≤ 2% |
| 0.28 | 90 – 120 | ≤ 2% |
| 0.36 | 10 – 100 | ≤ 5% |
| 0.55 | 50 – 90 | ≤ 2% |
| 0.77 | 70 – 130 | ≤ 2% |
| 0.82 | 90 – 110 | ≤ 2% |
| 1.0 | 20 – 50 | ≤ 5% |
| 1.2 | 40 – 60 | ≤ 2% |
Industrial Application Scenarios
Rubber Industry Cross-linking
Acts as a primary crosslinker for addition molding silicone rubber and a bridging/anti-yellowing agent for HTV rubber compounding.
Waterproofing & Surface Treatment
Forms a durable waterproof film on fabrics, paper, leather, ceramics, and marble. High hydrogen grades act as an insulator for MgO surface treatment.
Chemical Synthesis Intermediates
Key raw material for synthesizing polyether-modified, alkyl-modified, and water-soluble silicone oils, as well as defoamers.
Packaging & Storage Comparison
| Feature | High Hydrogen (1.58%) | Low Hydrogen (0.18% – 1.2%) |
|---|---|---|
| Standard Package | 200 kg or 1000 kg / barrel | 950 kg / barrel |
| Storage Period | More than 1 year | 12 months from production |
| Storage Environment | Cool, dry place; avoid alkaline substances | Cool, dry place; sealed packaging |
Frequently Asked Questions
+How is the waterproof film formed during usage?
Under the action of metal salt catalysts, the silicone-hydrogen bonds crosslink to form a waterproof film at low temperatures.
+What specific chemical groups can these oils react with?
Under appropriate catalysis, they react with double bonds, hydroxyl groups, and other active genes to produce leveling agents and defoamers.
Battery Applications
MESIL Hydrogen Silicone Fluid in Lithium Battery
Hydrogen-functional silicone is the crosslinker (Part B) in two-component addition-cure thermal interface materials. SEMITECH offers multiple architectures so TIM compounders can dial in crosslink density and final modulus to match their cell-to-cooling-plate gap geometry.